What specifications does Corfin process devices to?

Corfin processes devices to a Customer Process Authorization based on your own specifications and drawings, and to the following industry standards:

• MIL-PRF-38534 and  MIL-PRF-38535 for solder coverage
• IPC/ANSI-J-STD-001 for trim and forming
• IPC/ANSI-J-STD-002 for solderability
• MIL-STD-883, Method 1014, Conditions A1 and C1 for Fine and Gross Leak Testing
• ANSI Standard EIA-481 for Tape and Reeling

Corfin Industries has also processed devices to NASA, Military, Aerospace and Manned Space Flight specifications.

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I have a trim and form specification? What do I need to do?

If you already have a trim and form specification for your device, complete a Customer Requirements Form and send your lead form specification with sample parts to Corfin. Corfin will process your qualification samples to your specification and return them along with a quotation.

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I don't have a trim and form specification? What do I need to do?

If you don't have a lead preparation specification, provide Corfin with the mechanical package outline and your PCB pad layout, if it exists. Corfin will generate a trim and form specification and submit it for your approval. Corfin will then process qualification parts to the approved trim and form specifications sheet and return them to you along with a quotation.

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Why should devices be tinned after lead preparation?

During the trim and form process, the leads of the device are clamped, the existing lead finish is scraped and base material is exposed at the tip of the lead.

• This results in potential assembly and solderability problems if not tinned. Corfin tins all devices after being trimmed and formed.
• This eliminates potential assembly problems such as solderability, de-wetting, non-wetting and oxidation.

Corfin tins devices using Sn63/Pb37 Solder, which is compatible with the solder paste used in the PCB assembly process. This provides for better overall solder joint quality.

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What are the benefits and advantages of hot solder dipping versus plating?

Hot solder dipping is a chemical process with the following benefits:

• The solder finish is more dense than plating and has at least two years storage shelf life.
• The thicker solder coverage results in a greater volume of solder which improves toe and heel fillet in the solder joint and prevents insufficient solder joints.
• The process dissolves any existing gold lead finish:
  • It does not negatively affect the Nickel barrier layer
  • 63/37 tin-lead solder alloy is compatible with the solder paste used in PCB assembly processes.
  • Eliminates gold embrittlement problems, which may occur after PCB assembly.

Plating of leads is an electrolytic process, typically using 96/4 or 90/10 tin-lead solder alloy.

• The finish thickness is typically less than half that of hot solder (50-100 microinches).
• Plated leads have a short life before oxidation of the lead finish starts (typically 30 days) due to porosity.

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My parts are ESD-sensitive. How does Corfin ensure that my parts are protected?

Corfin maintains an ESD program to MIL-STD-1686

• Our production areas have ESD conductive tiles connected to ground.
• Each production area has separate temperature and humidity monitors and controls.
• All personnel wear ESD smocks, heel straps, continuously-monitored wrist straps, and finger cots.
• All paperwork is kept in static-safe travelers, unless removed at least 12 inches from unprotected devices.
• Corfin has been certified by various Military and Commercial companies to be at < 50 volts ESD potential at the work surface.

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Can Corfin process small lots?

Corfin processes lot sizes from small, prototype volumes to high, on-going production volumes:

• Corfin presently is processing over 3,200 different package styles.
• Typically, for any lot size greater than 100 units, there is no set-up charge.

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What package types can Corfin process?

Corfin processes over 3200 different package styles, including:

• Flat packs, QFPs, SOICs, SSOPs, TSSOPs, TSOPs, QSOPs LCCs, PGAs, ASICs, RF Power Transistors, GaAs MMICs, Fiber Optics, Lasers, and SAW Filters.

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Can Corfin provide devices with a No Lead finish?

Corfin can provide lead finish with No Lead solder:

• The customer needs to specify the alloy required.
• The customer can provide the alloy or Corfin can procure the alloy.
• Corfin has successfully processed devices using 99.3/0.7 (Tin/Copper) no lead alloy.
• Corfin has the capability of using any alloy you require.

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How does Corfin ensure that parts meet the customer's satisfaction?

Corfin generates a Customer Process Authorization (CPA) sheet for each process.

• The CPA specifies the Customer's exact process, handling and packaging requirements.
• The CPA is reviewed and approved by Corfin's Quality Manager and the Customer and then becomes the controlling process specification.
• Corfin also processes a set-up part, which is verified by the processing engineer and Quality representative, to verify that the process is within specifications and maintains SPC data on all lots.

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What is Corfin's typical process flow?

Corfin's typical process is:

• Parts are received; a Production Job number is assigned
• 100% visual Inspection, count verification and mechanical measurements
• Equipment set-up per CPA
• First piece processed
  • First piece sample is verified
  • Samples inspected using 10x microscope for:
    • Trim and Form Measurements
    • Lead finish quality
• Sample in-process inspection
• 100% Post Process Inspection
• 100% Final Inspection
• Parts shipped

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After parts are processed, how are the parts shipped back to the customer?

After the parts have been processed, Corfin packages the product in Matrix Trays, Tubes, or Tape and Reel per the CPA.

• Corfin can cross-reference your packaging requirements and provide a quotation for the appropriate package.
• If off-the-shelf shipping packages are not available, Corfin can provide custom Matrix Trays, Tubes, or Carrier Tape.

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What kind of tooling does Corfin use to trim, form, and tin components?

Corfin can trim and form devices using any of the following:

• Customer-consigned tooling
• Corfin's Universal Tooling:
  • Universal Tooling is used for processing prototype or low volume devices
• Adjustable Tooling
• Dedicated Dies
  • Adjustable Tooling and Dedicated Die Sets are used for on-going, high volume production or for those applications that require specific lead form geometries.

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How do I get a quotation?

Call us at 603.893.9900, we'll ask you to do the following:

• Complete a Customer Requirements Form.
• Fill out a Component Trim and Form Specification Sheet.
• Forward these, along with sample parts, to Corfin.

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